XC3S700A-4FTG256I

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XC3S700A-4FTG256I

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IC FPGA 161 I/O 256FTBGA

  • メーカーAMD

  • メーカー品番 #XC3S700A-4FTG256I

  • 在庫状況2625

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Series Spartan®-3A
Part Status Obsolete
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 13248
Total RAM Bits 368640
Number of I/O 161
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number XC3S700
Number of LA Bs / CL Bs 1472
Number of Gates 700000

概要

Description

The XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. It features a capacity of 700,000 system gates, making it suitable for a wide range of applications, including digital signal processing, embedded systems, and communications.
Key specifications include:
- Architecture: Based on a 90nm process technology, offering a balance of performance and power efficiency.
- Logic Cells: Contains 3,840 logic cells with a combination of lookup tables (LUTs) and flip-flops.
- I/O Ports: Supports up to 156 I/O pins with various voltage standards.
- Memory: Includes 56 kilobits of block RAM for data storage and buffering.
- Configuration: Can be configured via JTAG or flash memory, supporting multiple design implementations.
The XC3S700A is ideal for prototyping and developing complex digital systems, providing flexibility and scalability for engineers and designers.

Equivalent

The XC3S700A-4FTG256I is a Xilinx Spartan-3 FPGA. Equivalent products include the Lattice ECP3-70, Altera Cyclone III EP3C70, and Xilinx Spartan-6 XC6SLX75. These alternatives share similar logic density, performance, and features suitable for various applications. Always verify specific requirements and compatibility for your design needs.

Features

The XC3S700A-4FTG256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. Key features include:
- Configuration: 700,000 system gates, offering significant logic capacity for various applications.
- I/O Pins: 256-ball fine-pitch ball grid array (BGA) package with up to 232 user I/O pins.
- Performance: Operates at a maximum clock frequency of 200 MHz, suitable for high-speed applications.
- Memory: Supports up to 88 Kbits of embedded block RAM and 4 Kbits of distributed RAM.
- DSP Blocks: Contains dedicated DSP slices for efficient signal processing tasks.
- Power Consumption: Low power operation, making it ideal for battery-powered devices.
- Configuration Options: Supports various configuration modes, including JTAG and SPI.
- Development Tools: Compatible with Xilinx design tools like ISE and Vivado for easy design implementation.
These features make the XC3S700A-4FTG256I suitable for a wide range of applications, including communications, automotive, and industrial control systems.

Pinout

The XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3A family. It has a pin count of 256.
The primary functions of the XC3S700A include digital signal processing, complex logic implementation, and interfacing with various peripherals and communication protocols. It supports multiple I/O standards, has configurable logic blocks, and features dedicated hardware for tasks like multiplier and distributed RAM. The FPGA is designed for applications in consumer electronics, automotive, telecommunications, and other industries that require customizable logic solutions.
Overall, the XC3S700A-4FTG256I provides a versatile platform for implementing a wide range of digital designs efficiently.

Manufacturer

The XC3S700A-4FTG256I is manufactured by Xilinx, Inc., a prominent company in the semiconductor industry. Founded in 1984 and headquartered in San Jose, California, Xilinx specializes in designing and producing programmable logic devices, such as field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and associated software tools.
Xilinx is known for its innovation in the field of reconfigurable computing, enabling engineers to create custom hardware solutions tailored to specific applications. The company serves various industries, including telecommunications, automotive, aerospace, defense, industrial automation, and consumer electronics. Xilinx's products are widely utilized in applications ranging from signal processing and data processing to high-performance computing and artificial intelligence.
In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and expanding its reach in the semiconductor market. The XC3S700A-4FTG256I is part of the Spartan-3A series, which is designed for low-cost, high-performance applications.

Application

The XC3S700A-4FTG256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 series. Its application areas include:
1. Embedded Systems: For custom hardware acceleration and processing.
2. Telecommunications: Used in signal processing and protocol implementation.
3. Industrial Automation: For control systems and machinery interfacing.
4. Consumer Electronics: In devices requiring hardware customization.
5. Automotive: For advanced driver-assistance systems (ADAS) and infotainment systems.
6. Aerospace and Defense: In avionics and military communication systems.
This FPGA supports various logic-intensive applications due to its flexibility and programmable architecture.

Package

The XC3S700A-4FTG256I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with a 256-ball configuration. This type of package provides efficient thermal performance and is suitable for high-density applications.

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