画像は参考用です
XCV2000E-7BG560C
+BOMIC FPGA 404 I/O 560MBGA
-
メーカーAMD
-
メーカー品番 #XCV2000E-7BG560C
-
在庫状況2118
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | Virtex®-E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 655360 |
| Number of I/O | 404 |
| Number of Gates | 2541952 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Supplier Device Package | 560-MBGA (42.5x42.5) |
| Base Product Number | XCV2000E |
| Number of Logic Elements/Cells | 43200 |
| Number of LABs/CLBs | 9600 |
概要
Description
Key specifications include a 7-speed grade, supporting a maximum clock frequency of up to 200 MHz, and it comes in a 560-pin BGA (Ball Grid Array) package. The device supports various I/O standards, providing flexibility for interfacing with other components.
The FPGA is equipped with a rich set of configurable logic blocks (CLBs), digital signal processing (DSP) slices, and embedded memory resources, allowing for efficient implementation of algorithms and data processing tasks. Its reconfigurability enables rapid prototyping and iterative design, making it ideal for applications in telecommunications, automotive, aerospace, and industrial control systems.
Overall, the XCV2000E-7BG560C balances performance, flexibility, and power efficiency, making it a popular choice for engineers needing custom hardware solutions.
Equivalent
Features
1. Logic Cells: It has approximately 2,000 logic cells, enabling complex digital designs.
2. Speed Grade: Rated at -7, this FPGA offers a maximum performance suitable for high-speed applications.
3. Package: Encased in a 560-ball BGA (Ball Grid Array) package, facilitating efficient thermal management and space optimization.
4. Configurable I/O: Supports multiple voltage standards and programmable I/O configurations, enhancing versatility in interfacing.
5. Embedded Block RAM: Provides built-in memory blocks for data storage, improving performance for memory-intensive applications.
6. DSP Slices: Includes dedicated DSP slices for efficient digital signal processing, making it ideal for communications and multimedia applications.
7. Development Support: Compatible with various Xilinx development tools, enabling easier design and implementation.
These features make the XCV2000E-7BG560C suitable for a wide range of applications, including telecommunications, automotive, and industrial control systems.
Pinout
The primary functions of this FPGA include support for various programmable logic applications, digital signal processing, and high-performance computing tasks. It provides a flexible architecture allowing designers to implement custom logic, interconnects, and memory configurations. Key capabilities include multiple configurable I/O standards, high-speed serial transceivers, and the ability to integrate complex designs within a single chip. The "7" in the part number indicates the speed grade, while "BG" denotes the package type (BGA - Ball Grid Array).
Overall, the XCV2000E-7BG560C is suited for applications requiring high logic density and performance.
Manufacturer
The company's products are widely used in various industries, including telecommunications, automotive, aerospace, defense, data centers, and consumer electronics. Xilinx focuses on providing high-performance, flexible solutions that enable designers to create innovative and efficient systems. In October 2020, Xilinx was acquired by AMD (Advanced Micro Devices), a leading manufacturer of computer processors and graphics cards, further expanding its capabilities in the semiconductor market.